About Us:
Vanguard International Semiconductor Corporation (VIS) is a leading specialty IC foundry service provider established in 1994 in Hsinchu Science Park, Taiwan. VIS is dedicated to delivering cost competitive solutions, advanced process technologies, and high value added services. Through continuous innovation and efficiency improvement, VIS supports global customers in achieving manufacturing excellence.
Job Description:
Manage OSAT operations, including productivity improvement, line yield, SPC monitoring, and audit coordination.
Lead new backend process development and establish collaboration with new OSAT partners.
Drive 300mm wafer bumping, flipchip packaging, and advanced package development projects.
Qualifications
Minimum 5 years of experience in BGBM, CuRDL, bumping, or packaging related fields.
Strong coordination and communication skills for cross functional collaboration between VIS teams and OSAT partners.
Familiar with Quality Systems such as VDA 6.3.
Preferred Skills
- Proficient in English communication for customer
Education
- Bachelor's degree or above in Electrical Engineering, Electronic Engineering, Mechanical Engineering, or related disciplines.
Language Requirements
- Fluency in both written and spoken English and Mandarin.