返回查詢:Platform Technology / 新竹縣

Job Description
"1. SIP Module Business model & Technology Roadmap Planning

  • SIP (System in Package) Module strategy, state of Art technology to realize complex SIP module with complex SOC, PMIC, Memory within the SIP module.
  • Establish an echo system partners from technology Partners as Memory, Power Management and also Industrialization partners who support latest package & manufacture technology to realize SIP module robust, compatible and commercially competitive.
  • Well define SIP product specification and process.
  • Support OEM & Tier 1 customers' integration concept.
  • Identify value added for our products, from technology and also system level commercial aspect"

Requirement